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Home > Bidhaa > Panasonic Chip Mounter > Mashine ya Uwekaji Paneli NPM-W2
Mashine ya Uwekaji Paneli NPM-W2
  • Mashine ya Uwekaji Paneli NPM-W2

Mashine ya Uwekaji Paneli NPM-W2

    Aina ya malipo: T/T
    Incoterm: FOB,CIF,EXW
    Min. Amri: 1 Bag/Bags
    Muda wa Utoaji: 7 Siku

Maelezo ya Msingi

Mfano wa Mfano.: NPM-W2

Additional Info

Ufungaji: Ufungashaji wa utupu katika kesi za mbao

Brand: Panasonic

Usafiri: Ocean

Mahali ya Mwanzo: Japan

Bandari: Hong Kong,Shen Zhen

Maelezo ya bidhaa

Vipengele

Uzalishaji wa juu na ubora na uchapishaji, uwekaji na mchakato wa ukaguzi

Kulingana na PCB unayotayarisha, unaweza kuchagua hali ya kasi ya juu au hali ya usahihi wa hali ya juu.

Kwa bodi kubwa na sehemu kubwa

PCB hadi saizi ya 750 x 550 mm na sehemu ya kiwango cha hadi L150 x W25 x T30 mm

Uzalishaji wa eneo la juu kupitia uwekaji wa njia mbili

Kulingana na PCB unayotengeneza, unaweza kuchagua njia bora ya uwekaji - "Independent" "Alternate " au [ mseto "

Panasonic Machine Npm W2

Maelezo

Model ID NPM-W2
                          Rear head
Front head
Lightweight
16-nozzle head

12-nozzle

 head

Lightweight
8-nozzle head
3-nozzle head V2

Dispensing

 head

No head
Lightweight 16-nozzle head NM-EJM7D NM-EJM7D-MD NM-EJM7D
12-nozzle head
Lightweight 8-nozzle head
3-nozzle head V2
Dispensing head NM-EJM7D-MD             - NM-EJM7D-D
Inspection head NM-EJM7D-MA NM-EJM7D-A
No head NM-EJM7D NM-EJM7D-D           -

PCB
dimensions
(mm)
Single-lane*1 Batch mounting L 50 x W 50 ~ L 750 x W 550
2-positin mounting L 50 x W 50 ~ L 350 x W 550
Dual-lane*1 Dual transfer (Batch) L 50 × W 50 ~ L 750 × W 260
Dual transfer (2-positin) L 50 × W 50 ~ L 350 × W 260
Single transfer (Batch) L 50 × W 50 ~ L 750 × W 510
Single transfer (2-positin) L 50 × W 50 ~ L 350 × W 510
Electric source 3-phase AC 200, 220, 380, 400, 420, 480 V 2.8 kVA
Pneumatic source *2 0.5 MPa, 200 L /min (A.N.R.)
Dimensions *2 (mm) W 1 280*3 × D 2 332 *4 × H 1 444 *5
Mass 2 470 kg (Only for main body : This differs depending on the option configuration.)

Placement head Lightweight 16-nozzle head
(Per head)
12-nozzle head
(Per head)
Lightweight
8-nozzle head
(Per head)
3-nozzle head V2
(Per head)
High production mode
[ON]
High production mode
[OFF]
High production mode
[ON]
High production mode
[OFF]
Max. speed 38 500cph
(0.094 s/ chip)
35 000cph
(0.103 s/ chip)
32 250cph
(0.112 s/ chip)
31 250cph
(0.115 s/ chip)
20 800cph
(0.173 s/ chip)
8 320cph
(0.433 s/ chip)
6 500cph
(0.554 s/ QFP)
Placement accuracy
(Cpk1)
±40 μm / chip ±30 μm / chip
(±25μm / chip)*6
±40 μm / chip ±30 μm / chip ± 30 µm/chip
± 30 µm/QFP
12mm to 32mm
± 50 µm/QFP
12mm Under
± 30 µm/QFP
Component
dimensions
(mm)
0402*7 chip ~ L 6 x W 6 x T 3 03015*7 *8/0402*7 chip ~ L 6 x W 6 x T 3 0402*7 chip ~ L 12 x W 12 x T 6.5 0402*7 chip ~ L 32 x W 32 x T 12 0603 chip to L 150 x W 25 (diagonal152) x T 30
Component
supply
Taping Tape : 4 / 8 / 12 / 16 / 24 / 32 / 44 / 56 mm Tape : 4 to 56 mm Tape : 4 to 56 / 72 / 88 / 104 mm
Max.120 (Tape: 4, 8 mm) Front/rear feeder cart specifications : Max.120
( Tape width and feeder are subject to the conditions on the left)
Single tray specifications : Max.86
( Tape width and feeder are subject to the conditions on the left)
Twin tray specifications : Max.60
( Tape width and feeder are subject to the conditions on the left)
Stick                                                             - Front/rear feeder cart specifications :
Max.30 (Single stick feeder)
Single tray specifications :
Max.21 (Single stick feeder)
Twin tray specifications :
Max.15 (Single stick feeder)
Tray                                                             - Single tray specifications : Max.20
Twin tray specifications : Max.40

Dispensing head Dot dispensing Draw dispensing
Dispensing speed 0.16 s/dot (Condition : XY=10 mm, Z=less than 4 mm movement, No θ rotation) 4.25 s/component (Condition : 30 mm x 30 mm corner dispensing)*9
Adhesive position accuracy (Cpk ± 75 μ m /dot ± 100 μ m /component
1)
Applicable components 1608 chip to SOP,PLCC,QFP, Connector, BGA, CSP BGA, CSP
Inspection head 2D inspection head (A) 2D inspection head (B) 
Resolution 18 µm 9 µm
View size (mm) 44.4 x 37.2 21.1 x 17.6
Inspection
processing
time
Solder
Inspection *10
0.35s/ View size
Component
Inspection *10
0.5s/ View size
Inspection
object
Solder
Inspection *10
Chip component : 100 μm × 150 μm or more (0603 or more)
Package component : φ150 μm or more
Chip component : 80 μm × 120 μm or more (0402 or more)
Package component : φ120 μm or more
Component
Inspection *10
Square chip (0603 or more), SOP, QFP (a pitch of 0.4mm or more), CSP, BGA, Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*11 Square chip (0402 or more), SOP, QFP (a pitch of 0.3mm or more), CSP, BGA,Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*11
Inspection
items
Solder
Inspection *10
Oozing, blur, misalignment, abnormal shape, bridging
Component
Inspection *10
Missing, shift, flipping, polarity, foreign object inspection *12
Inspection position accuracy *13
( Cpk  1)
± 20 μm ± 10 μm
No. of
inspection
Solder
Inspection *10
Max. 30 000 pcs./machine (No. of components : Max. 10 000 pcs./machine)
Component
Inspection *10
Max. 10 000 pcs./machine


*1

:

Please consult us separately should you connect it to NPM-D3/D2/D. It cannot be connected to NPM-TT and NPM.

*2

:

Only for main body

*3

:

1 880 mm in width if extension conveyors (300 mm) are placed on both sides.

*4

:

Dimension D including tray feeder : 2 570 mm
Dimension D including feeder cart : 2 465 mm

*5

:

Excluding the monitor, signal tower and ceiling fan cover.

*6

:

±25 μm placement support option.(Under conditions specified by PSFS)

*7

:

The 03015/0402 chip requires a specific nozzle/feeder.

*8

:

Support for 03015 mm chip placement is optional. (Under conditions specified by PSFS:Placement accuracy ±30 μm / chip)

*9

:

A PCB height measurement time of 0.5s is included.

*10

:

One head cannot handle solder inspection and component inspection at the same time.

*11

:

Please refer to the specification booklet for details.

*12

:

Foreign object is available to chip components.(Excluding 03015 mm chip)

*13

:

This is the solder inspection position accuracy measured by our reference using our glass PCB for plane calibration. It may be affected by sudden change of ambient temperature.

Shenzhen Keith Electronic Equipment Co, Ltd "iko katika Wilaya ya Baoan, Shenzhen. Ni muuzaji wa vifaa vya AI na SMT, vipuri, vinywaji na vifaa vya matumizi vya kusaidia nchini China. Kwa miaka mingi, tumetoa vifaa vya juu na sehemu kwa wateja wetu ili kuhakikisha huduma ya hali ya juu. Na kwa soko la kuuza nje, tunapanga kuendeleza Ulaya, Amerika ya Kaskazini, Amerika Kusini, Asia ya Kusini, India na mahali panapohitajika vifaa vya vifaa vya SMT.
Falsafa ya biashara: ushirikiano, kushinda-kushinda, uvumbuzi, msaada wa pande zote
Tumekuwa tukiandamana na dhana ya usimamizi wa chapa ya "kuzingatia ubora wa bidhaa na mahitaji ya wateja", kupitia utekelezaji wa uvumbuzi wazi, usimamizi bora wa operesheni, maendeleo ya rasilimali watu na mikakati mingine, ili kujenga kikamilifu ushindani wa msingi wa kampuni, kuunda wateja na maadili ya kijamii, na mshinde sifa moja ya idadi kubwa ya wateja na jamii.
Bidhaa kuu:
Mashine ya Kuingiza Panasonic, Sehemu za Mashine za Kuingiza Paneli, Mashine ya Kuweka Paneli, Sehemu za Mashine za Kuweka Paneli, Sehemu ya kulisha & Mafunguo ya feeder, Mchanganyiko wa Trolley, SMT Squeegee nk Kujifunza zaidi juu ya bidhaa zetu, tafadhali wasiliana nasi kupitia anwani ya barua pepe ifuatayo. ushirikiano wako!



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