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Home > Bidhaa > Panasonic Chip Mounter > Mashine ya Uwekaji Paneli NPM-W
Mashine ya Uwekaji Paneli NPM-W
  • Mashine ya Uwekaji Paneli NPM-W

Mashine ya Uwekaji Paneli NPM-W

    Incoterm: FOB,CIF,EXW

Maelezo ya Msingi

Mfano wa Mfano.: NPM-W

Additional Info

Ufungaji: Ufungashaji wa utupu katika kesi za mbao

Brand: Panasonic

Usafiri: Ocean

Mahali ya Mwanzo: Japan

Bandari: Hong Kong

Maelezo ya bidhaa

Vipengele na Faida
Uzalishaji wa eneo la jirani na mistari ya jumla ya kuweka
Uzalishaji wa juu na ubora na uchapishaji, uwekaji na mchakato wa ukaguzi
2.Bodi bodi kubwa na vifaa vikubwa
PCB hadi saizi ya 750 × 550 mm na sehemu ya kiwango cha hadi 150 × 25 mm
3.Uzalishaji wa eneo kubwa kupitia uwekaji wa njia mbili.

Kulingana na PCB unayotengeneza, unaweza kuchagua njia bora ya uwekaji - "Independent" "Mbadala" au "mseto"

Panasonic Machine Npm W2

Maelezo

Model ID NPM-W
                                                Rear head
Front head

16-nozzle

 head

12-nozzle 

head

8-nozzle 

head

3-nozzle

head

Dispensing

 head

No head
16-nozzle head NM-EJM2D NM-EJM2D-MD NM-EJM2D
12-nozzle head
8-nozzle head
3-nozzle head
Dispensing head NM-EJM2D-MD             - NM-EJM2D-D
Inspection head NM-EJM2D-MA NM-EJM2D-A
No head NM-EJM2D NM-EJM2D-D             -
PCB
dimensions
(mm)
Single-lane
mode*1
Batch
mounting
L 50 x W50 ~ L 750 x W 550
2-positin
mounting
L 50 x W50 ~ L 350 x W 550
Dual-lane
mode*1
Single L 50 x W50 ~ L 750 x W 510
transfer
Dual L 50 x W50 ~ L 750 x W 260
transfer
PCB
exchange
time
Single-lane
mode*1
Batch
mounting

4.4s

 ( With no component mounted on the reverse side of PCB )

2-positin
mounting

2.3s

 ( With no component mounted on the reverse side of PCB )

Dual-lane
mode*1
Single
transfer

4.4s

 ( With no component mounted on the reverse side of PCB )

Dual
transfer
0s*
*No 0s when cycle time is 4.4 s or less
Electric source 3-phase AC 200, 220, 380, 400, 420, 480 V 2.5 kVA
Pneumatic source *2 0.5 MPa, 200 L /min (A.N.R.)
Dimensions *2 (mm) W 1 280*3 × D 2 332 *4 × H 1 444 *5
Mass

2250 kg

 (Only for main body:This differs depending on the option configuration.)


Placement head 16-nozzle head
( With Dual Heads )
12-nozzle head
( With Dual Heads )
8-nozzle head
( With Dual Heads )
3-nozzle head
( With Dual Heads )
Placement speed 70 000cph
(0.051 s/ chip)
62 500cph
(0.058 s/ chip)
40 000cph
(0.090 s/ chip)
11 000 cph
(0.33 s/ QFP)
IPC9850 (1608) 53 800 cph*8 48 000 cph*8         -                -
Placement accuracy (Cpk1) ± 40 µm/chip

 ±40 µm/chip

± 30µm/QFP

12mm to 32mm
± 50 µm/QFP
12mm Under
± 30 µm/QFP
Component
dimensions
(mm)
(01005") 0402 chip*6 to
L 6 x W 6 x T 3
(01005") 0402 chip*6 to L 12 x W 12 x T 6.5 (01005") 0402 chip*6 to L 32 x W 32 x T 12 (0201'')0603 chip to L 150 × W 25 (diagonal152) × T 28
Component
supply
Taping Tape : 8 / 12 / 16 / 24 / 32 / 44 / 56 mm Tape : 8 to 56 / 72 mm Tape : 8 to 56 / 72 / 88 / 104 mm
Max.120
( 8 mm tape : double feeder, (small real) )
Front/rear feeder cart specifications : Max.120
 ( Tape width and feeder are subject to the conditions on the left)
Single tray specifications : Max.86
( Tape width and feeder are subject to the conditions on the left)
Twin tray specifications : Max.60
( Tape width and feeder are subject to the conditions on the left)
Stick                                      - Front/rear feeder cart specifications : Max.14
Single tray specifications : Max.10
Twin tray specifications : Max.7
Tray                                     - Single tray specifications : Max.20
Twin tray specifications : Max.40
Dispensing head Dot dispensing Draw dispensing
Dispensing speed 0.16 s/dot (Condition : XY=10 mm, Z=less than 4 mm movement, No θ rotation) 3.75 s/component
(Condition: 30 mm x 30 mm corner dispensing)
Adhesive position accuracy (Cpk1) ± 75 μ m /dot ± 100 μ m /component
Applicable components 1608 chip to SOP,PLCC,QFP, Connector, BGA, CSP SOP,PLCC,QFP, Connector, BGA, CSP
Inspection head 2D inspection head (A) 2D inspection head (B)
Resolution 18 µm 9 µm
View size (mm) 44.4 x 37.2 21.1 x 17.6
Inspection
processing
time
Solder
Inspection *10
0.35s/ View size
Component
Inspection *10
0.5s/ View size
Inspection
object
Solder
Inspection *10
Chip component : 100 μm × 150 μm or more (0603 / 0201" or more)
Package component : φ150 μm or more
Chip component : 80 μm × 120 μm or more (0402 / 01005" or more)
Package component : φ120 μm or more
Component
Inspection *10
Square chip (0603 / 0201" or more), SOP, QFP (a pitch of 0.4mm or more), CSP, BGA, Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector, Network resistor, Transistor, Diode, Inductor, Tantalum capacitor, Melf Square chip (0402 / 01005" or more), SOP, QFP (a pitch of 0.3mm or more), CSP, BGA,Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector, Network resistor, Transistor, Diode, Inductor, Tantalum capacitor, Melf
Inspection
items
Solder
Inspection *10
Oozing, blur, misalignment, abnormal shape, bridging
Component
Inspection *10
Missing, shift, flipping, polarity, foreign object inspection *9
Inspection position accuracy*11
( Cpk1)
± 20 μm ± 10 μm
No. of
inspection
Solder
Inspection *10
Max. 30 000 pcs./machine (No. of components : Max. 10 000 pcs./machine)
Component
Inspection *10
Max. 10 000 pcs./machine
* 1: Tafadhali wasiliana nasi kando ikiwa unaweza kuiunganisha kwa NPM-D. Haiwezi kushikamana na NPM-TT na NPM.
* 2: Kwa mwili kuu tu
* 3: 1 880 mm kwa upana ikiwa vifaa vya ugani (300 mm) vimewekwa pande zote.
* 4: Vipimo D pamoja na tray feeder: 2 570 mm Vipimo D pamoja na gari la feeder: 2 465 mm
* 5: Isipokuwa ya kufuatilia na mnara wa ishara
* 6: Chip 0402 inahitaji nozzle maalum / feeder.
* 7: 3-nozzle kichwa haiwezi kusanikishwa kwa NPM-D.
* 8: Ni nukuu ya kumbukumbu ya wakati wa uangalifu wa IPC9850 inayokadiriwa katika hali mbili inayorudishi / huru.
* 9: Kitu cha kigeni kinapatikana kwa vifaa vya chip.
* 10: Kichwa kimoja hakiwezi kushughulikia ukaguzi wa solder na ukaguzi wa sehemu kwa wakati mmoja.
* 11: Hii ndio usahihi wa ukaguzi wa mpimaji unaopimwa na rejista yetu kwa kutumia PCB yetu ya glasi kwa hesabu ya ndege. Inaweza kuathiriwa na mabadiliko ya ghafla ya joto iliyoko.
* Wakati wa uangalizi wa uwekaji, wakati wa ukaguzi na maadili ya usahihi yanaweza kutofautiana kulingana na hali
* Tafadhali rejelea kijitabu maalum kwa maelezo.

Shenzhen Keith Electronic Equipment Co, Ltd "iko katika Wilaya ya Baoan, Shenzhen. Ni muuzaji wa vifaa vya AI na SMT, vipuri, vinywaji na vifaa vya matumizi vya kusaidia nchini China. Kwa miaka mingi, tumetoa vifaa vya juu na sehemu kwa wateja wetu ili kuhakikisha huduma ya hali ya juu. Na kwa soko la kuuza nje, tunapanga kuendeleza Ulaya, Amerika ya Kaskazini, Amerika Kusini, Asia ya Kusini, India na mahali panapohitajika vifaa vya vifaa vya SMT.
Falsafa ya biashara: ushirikiano, kushinda-kushinda, uvumbuzi, msaada wa pande zote
Tumekuwa tukiandamana na dhana ya usimamizi wa chapa ya "kuzingatia ubora wa bidhaa na mahitaji ya wateja", kupitia utekelezaji wa uvumbuzi wazi, usimamizi bora wa operesheni, maendeleo ya rasilimali watu na mikakati mingine, ili kujenga kikamilifu ushindani wa msingi wa kampuni, kuunda wateja na maadili ya kijamii, na mshinde sifa moja ya idadi kubwa ya wateja na jamii.
Bidhaa kuu:
Mashine ya Kuingiza Panasonic, Sehemu za Mashine za Kuingiza Paneli, Mashine ya Kuweka Paneli, Sehemu za Mashine za Kuweka Paneli, Sehemu ya kulisha & Mafunguo ya feeder, Mchanganyiko wa Trolley, SMT Squeegee nk Kujifunza zaidi juu ya bidhaa zetu, tafadhali wasiliana nasi kupitia anwani ya barua pepe ifuatayo. ushirikiano wako!



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