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Nicolas Mr. Nicolas
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Panasonic Placement Machine NPM-W2
  • Panasonic Placement Machine NPM-W2

Panasonic Placement Machine NPM-W2

    Totogi totogi: T/T
    Incoterm: FOB,CIF,EXW
    Min. Poloaiga: 1 Bag/Bags
    Taimi o Taimi: 7 Aso

Faʻamatalaga Autu

Faataʻitaʻiga No.: NPM-W2

Additional Info

Faʻapaʻu: Faʻapena avanoa i laupapa

Faailoga: Panasonic

Felauaiga: Ocean

Nofoaga o le Amataga: Iapani

Port: Hong Kong,Shen Zhen

Faamatalaga o oloa

Faʻapitoa

Siʻitia le faʻatupulaia ma le lelei ma le lolomiina, faʻapipiʻiina ma le siakiina o le faʻaaogaina

Faʻalagolago i le PCB e te maua, e mafai ona e filifilia le tele-speed or mode High-mode mode.

Mo laupapa lapoa ma mea tetele

PCBs e oo atu i le tele o le 750 x 550 mm ma le vaega e oʻo atu i L150 x W25 x T30 mm

Faʻaauau le faʻatupulaia o le vaega e ala i le tuʻuina atu o ni laina se lua

Faʻalagolago i le PCB e te maua, e mafai ona e filifilia se tulaga e sili ona lelei e faʻatulagaina ai - "Tutoatasi" "Suʻega " poʻo le [ vaifofo ]

Panasonic Machine Npm W2

Faʻamatalaga

Model ID NPM-W2
                          Rear head
Front head
Lightweight
16-nozzle head

12-nozzle

 head

Lightweight
8-nozzle head
3-nozzle head V2

Dispensing

 head

No head
Lightweight 16-nozzle head NM-EJM7D NM-EJM7D-MD NM-EJM7D
12-nozzle head
Lightweight 8-nozzle head
3-nozzle head V2
Dispensing head NM-EJM7D-MD             - NM-EJM7D-D
Inspection head NM-EJM7D-MA NM-EJM7D-A
No head NM-EJM7D NM-EJM7D-D           -

PCB
dimensions
(mm)
Single-lane*1 Batch mounting L 50 x W 50 ~ L 750 x W 550
2-positin mounting L 50 x W 50 ~ L 350 x W 550
Dual-lane*1 Dual transfer (Batch) L 50 × W 50 ~ L 750 × W 260
Dual transfer (2-positin) L 50 × W 50 ~ L 350 × W 260
Single transfer (Batch) L 50 × W 50 ~ L 750 × W 510
Single transfer (2-positin) L 50 × W 50 ~ L 350 × W 510
Electric source 3-phase AC 200, 220, 380, 400, 420, 480 V 2.8 kVA
Pneumatic source *2 0.5 MPa, 200 L /min (A.N.R.)
Dimensions *2 (mm) W 1 280*3 × D 2 332 *4 × H 1 444 *5
Mass 2 470 kg (Only for main body : This differs depending on the option configuration.)

Placement head Lightweight 16-nozzle head
(Per head)
12-nozzle head
(Per head)
Lightweight
8-nozzle head
(Per head)
3-nozzle head V2
(Per head)
High production mode
[ON]
High production mode
[OFF]
High production mode
[ON]
High production mode
[OFF]
Max. speed 38 500cph
(0.094 s/ chip)
35 000cph
(0.103 s/ chip)
32 250cph
(0.112 s/ chip)
31 250cph
(0.115 s/ chip)
20 800cph
(0.173 s/ chip)
8 320cph
(0.433 s/ chip)
6 500cph
(0.554 s/ QFP)
Placement accuracy
(Cpk1)
±40 μm / chip ±30 μm / chip
(±25μm / chip)*6
±40 μm / chip ±30 μm / chip ± 30 µm/chip
± 30 µm/QFP
12mm to 32mm
± 50 µm/QFP
12mm Under
± 30 µm/QFP
Component
dimensions
(mm)
0402*7 chip ~ L 6 x W 6 x T 3 03015*7 *8/0402*7 chip ~ L 6 x W 6 x T 3 0402*7 chip ~ L 12 x W 12 x T 6.5 0402*7 chip ~ L 32 x W 32 x T 12 0603 chip to L 150 x W 25 (diagonal152) x T 30
Component
supply
Taping Tape : 4 / 8 / 12 / 16 / 24 / 32 / 44 / 56 mm Tape : 4 to 56 mm Tape : 4 to 56 / 72 / 88 / 104 mm
Max.120 (Tape: 4, 8 mm) Front/rear feeder cart specifications : Max.120
( Tape width and feeder are subject to the conditions on the left)
Single tray specifications : Max.86
( Tape width and feeder are subject to the conditions on the left)
Twin tray specifications : Max.60
( Tape width and feeder are subject to the conditions on the left)
Stick                                                             - Front/rear feeder cart specifications :
Max.30 (Single stick feeder)
Single tray specifications :
Max.21 (Single stick feeder)
Twin tray specifications :
Max.15 (Single stick feeder)
Tray                                                             - Single tray specifications : Max.20
Twin tray specifications : Max.40

Dispensing head Dot dispensing Draw dispensing
Dispensing speed 0.16 s/dot (Condition : XY=10 mm, Z=less than 4 mm movement, No θ rotation) 4.25 s/component (Condition : 30 mm x 30 mm corner dispensing)*9
Adhesive position accuracy (Cpk ± 75 μ m /dot ± 100 μ m /component
1)
Applicable components 1608 chip to SOP,PLCC,QFP, Connector, BGA, CSP BGA, CSP
Inspection head 2D inspection head (A) 2D inspection head (B) 
Resolution 18 µm 9 µm
View size (mm) 44.4 x 37.2 21.1 x 17.6
Inspection
processing
time
Solder
Inspection *10
0.35s/ View size
Component
Inspection *10
0.5s/ View size
Inspection
object
Solder
Inspection *10
Chip component : 100 μm × 150 μm or more (0603 or more)
Package component : φ150 μm or more
Chip component : 80 μm × 120 μm or more (0402 or more)
Package component : φ120 μm or more
Component
Inspection *10
Square chip (0603 or more), SOP, QFP (a pitch of 0.4mm or more), CSP, BGA, Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*11 Square chip (0402 or more), SOP, QFP (a pitch of 0.3mm or more), CSP, BGA,Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*11
Inspection
items
Solder
Inspection *10
Oozing, blur, misalignment, abnormal shape, bridging
Component
Inspection *10
Missing, shift, flipping, polarity, foreign object inspection *12
Inspection position accuracy *13
( Cpk  1)
± 20 μm ± 10 μm
No. of
inspection
Solder
Inspection *10
Max. 30 000 pcs./machine (No. of components : Max. 10 000 pcs./machine)
Component
Inspection *10
Max. 10 000 pcs./machine


*1

:

Please consult us separately should you connect it to NPM-D3/D2/D. It cannot be connected to NPM-TT and NPM.

*2

:

Only for main body

*3

:

1 880 mm in width if extension conveyors (300 mm) are placed on both sides.

*4

:

Dimension D including tray feeder : 2 570 mm
Dimension D including feeder cart : 2 465 mm

*5

:

Excluding the monitor, signal tower and ceiling fan cover.

*6

:

±25 μm placement support option.(Under conditions specified by PSFS)

*7

:

The 03015/0402 chip requires a specific nozzle/feeder.

*8

:

Support for 03015 mm chip placement is optional. (Under conditions specified by PSFS:Placement accuracy ±30 μm / chip)

*9

:

A PCB height measurement time of 0.5s is included.

*10

:

One head cannot handle solder inspection and component inspection at the same time.

*11

:

Please refer to the specification booklet for details.

*12

:

Foreign object is available to chip components.(Excluding 03015 mm chip)

*13

:

This is the solder inspection position accuracy measured by our reference using our glass PCB for plane calibration. It may be affected by sudden change of ambient temperature.

Shenzhen Keith Electronics Equipment Co., Ltd. "o loo i le Itumalo Baoan, Shenzhen. O se tagata e tuuina atu meafaigaluega a le AI ma le SMT, vaega o mea e faaaoga ai, mea taumafa ma punaoa taumafa o mea taumafa i China. I le gasologa o tausaga, ua matou saunia meafaigaluega ma vaega mo mea o le au faipisinisi e mautinoa le maualuga o le auaunaga. Ma mo le auina ese atu o maketi, tatou te naunau e atiaʻe Europa, Amerika i Matu, Amerika i Saute, Asia i Saute, Initia ma le mea e manaʻomia ai SMT mea faigaluega.
Faigamalo faapisinisi: felagolagomai, manumalo-win, innovation, fesoasoani felagolagomaʻi
O loʻo matou faʻaauau pea le manatu o le "taulai atu i le lelei o oloa ma manaoga o tagata o loʻo manaʻomia", e ala i le faʻatinoina o le faʻafouina fou, lelei le faʻatinoina o galuega, faʻaleaogaina o alamanuia ma isi taʻiala, e faʻatautaia le fausiaina o le tauvaga a le kamupani, fatuina le tagata faatau ma faʻatauaina lautele, ma manumalo i le autasi o le tele o tagata faʻatau ma sosaiete.
Mea autu:
Panasonic Insertion Machine, Panasonic Insertion Machine Parts, Panasonic Placement Machine, Pipa Panasonic Placement Machine, Panasonic Feeder & Feeder Parts, Feeder Trolley, SMT Squeegee ma isi mea faapena. Ina ia aoao atili e uiga ia tatou oloa, faʻamolemole faʻafesoʻotaʻi mai i matou i le tuatusi imeli o loʻo i lalo, faʻamoemoe lau fesoʻotaʻiga!



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