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X01A3702003 Panasonic AI PALLET RHS RHS2B RHSG
BGA packaging technology has such characteristics: although the number of I / O pins is increased, but the pin pitch is not small, thereby improving the assembly yield; although its power consumption is increased, the BGA can be soldered by a controlled collapse chip method. X01A3702003 X02G37000 X01A3702001...
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Privacy statement: Your privacy is very important to Us. Our company promises not to disclose your personal information to any external company with out your explicit permission.